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Remote New

Head of Intra Data Center Platforms

NOKIA
United States, California
Jun 27, 2026

Join the Optical Networks division, where innovation meets scale in the AI-driven data center era. With the recent acquisition of Infinera, we've united two industry leaders to create an optical networking powerhouse-combining cutting-edge technology with proven leadership to redefine the future of connectivity.


  • Define and deliver a strategy for silicon ASICs (multi-terabit) and the architecture of co-packaged optics platforms across inter / intra Data Center.
  • Define cross-domain system architecture (ASIC, optics, PCB, backplane, cooling) to meet AI network requirements in performance, cost, power, space, efficiency, telemetry, and modularity
  • Lead definition of integrated system development: hardware, optics, thermal, cooling, and packaging
  • Collaborate with hyperscaler and service provider customers to align product features with real-world deployment needs
  • Lead innovation in co-packaged optics, open standards, and partner ecosystems (Inphi, OIF, IEEE)
  • Evangelize AI networking advantages/impacts to enterprise, hyperscalers, and service providers
  • Gain industry mindshare, publish in leading conferences, represent the company in standards bodies, and foster R&D and academic partnerships
  • Partner / Mentor team as well as cross organizations in R&D, PLM, Marketing, Services, and Sales, ensuring company success
  • Ph.D. or equivalent in EE, IC, Optical/Network Architecture
  • 15+ years in high-performance system architecture: ASICs, optics, PCB, thermal management
  • Experience in defining and executing on multi-terabit platforms

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