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Principal Manufacturing Integration Engineer

NOKIA
US Salary range: $130,017.39 - $241,460.87
United States, California, Sunnyvale
1322 Bordeaux Drive (Show on map)
Feb 02, 2026

The wafer fab Integration engineer ensures seamless coordination between process development, manufacturing, and yield engineering teams to achieve optimal device performance, yield, and cycle time. This role will serve as the technical owner for product/process integration, overseeing new technology introduction, sustaining operations, and continuous improvement initiatives.

Own, manage and improve process control plan for new and existing products.

Collaborate with development and process engineering teams to introduce new technologies into high-volume manufacturing.

Lead qualification and ramp-up activities for new products and processes.

Analyze inline metrology, process data and defectivity trends to identify root causes of process shift or excursion.

Drive corrective actions and continuous improvement projects across multiple process areas.

Act as the primary interface between development, process, and manufacturing teams.

PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or

8+ years in semiconductor wafer fabrication, hands-on experience with wafer process, strong background in process integration.

Strong analytical and problem-solving skills; proficiency in data analysis tools (e.g., JMP, Python).

Excellent communication and leadership abilities to manage cross-functional teams.

Knowledge of SPC, DOE, and yield enhancement methodologies.

Experience in high-volume manufacturing environment.


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